PELCO® 35nm Silicon Nitride Support Films for TEM Aluminum conductive silicon minimizes charging during

conductive silicon minimizes charging during sample preparation and TEM imaging

7 Back Angle: 11 - 31 Side Angle: 1

specially formulated adhesive for demanding bonding applications such as:

The TiOx substrate is more bio-compatible and can also be used for life-science applications

PELCO® 35nm Silicon Nitride Support Films for TEM Aluminum conductive silicon minimizes charging duringDESCRIPTION PRODUCT SPECIFICATIONS 35nm membrane thickness 25 apertures 200m frame thickness 21515 10 Silicon Nitride Support Film, 35nm, 70x70m Aperture (25) on 0. 5 x 0. 5mm Window pkg 10 Defining parameters for the PELCO Silicon Nitride Support Films are: Film Thickness: Resilient, ultra low stress 8, 15, 35 or 50nm giving rise to minimum absorption to enable clear imaging; robust, low stress 200nm for better handling and use on multiple platforms;